As foldable smartphones emerge as a new handset trend, PCB makers are gearing up to meet the consequent market demand, according to industry sources.
A foldable smartphone has diverse PCB needs, flexible boards, rigid-flex boards, HDI (high density interconnect) boards and SLP (substrate-like PCBs) are all applicable, and those ready to tackle this type of PCB will maintain their leadership in foldable handset application market.
Smartphone vendors such as Samsung Electronics, Huawei, Oppo and TCL are releasing their respective foldable models. Interestingly, Apple holds firm in its decision not to jump on the bandwagon of foldable smartphones.
With such a new advancement, UK Electronics are interested to see what the future holds for foldable smartphone and their PCB technology.
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